Description
The bga solder paste is a high performance, low melting point and long service life. For rework or touchup of smd components such as bga, solder paste, speedlite and so on. For rework station and solder paste. Bga solder paste is a high viscosity noclean, which can be used as an auxiliary tool for the extraction of various tins. Bga solder paste, high temperature resistance, can be used repeatedly. And paste is a high viscosity noclean flux, used for pcb, smd, reworking.
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